| PART |
Description |
Maker |
| SOT926-1 |
plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
|
NXP Semiconductors
|
| FLGA-SD |
Fine Pitch Land Grid Array - Stacked Die
|
STATSCHIP[STATS ChipPAC, Ltd.]
|
| BC-148 |
148-Lead Chip Scale Package Ball Grid Array
|
Analog Devices, Inc.
AD[Analog Devices]
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Limited
|
| BGA-320P-M06 |
PLASTIC BALL GRID ARRAY PACKAGE 320 PIN PLASTIC
|
Fujitsu Component Limited.
FUJITSU[Fujitsu Media Devices Limited]
|
| AS4C32M16MD1A AS4C32M16MD1A-5BCN |
60 ball FBGA PACKAGE
|
Alliance Semiconductor ...
|
| 3-1640240-4 |
Matrix Series Ball Grid Array ( BGA ) Sockets; 2401 POSITION BGA SOCKET ASSEM ( Tyco Electronics )
|
Tyco Electronics
|
| CY62157DV18LL-70BVI CY62157DV18 CY62157DV18L-55BVI |
8M (512K x 16) Static RAM
Packages offered in a 48-ball FBGA
|
Cypress Semiconductor Corp.
CYPRESS[Cypress Semiconductor]
|
| AMG8852 AMG8851 AMG8831 AMG8832 |
Infrared Array Sensor Grid-EYE
|
Panasonic Semiconductor
|
| 614-99-108-12-051-112 612-13-108-12-051-101 612-91 |
CONNECTOR ACCESSORY
Pin grid array sockets Carrier types 插针网格阵列插座载体类型
|
PREDIP[Precid-Dip Durtal SA]
PRECI-DIP SA
|
| WSFX054-SERIES XSFX054-SERIES YSFX054-SERIES WSFX0 |
Cyclone II FPGA 35K FBGA-484
Interface IC 接口IC
CYCLONE III FPGA 25K 324-FBGA 接口IC
|
Ironwood Electronics
DB Lectro, Inc.
|
| YPKG-BCCG-9287DC |
CCGA1152, 35.0 MM X 35.0 MM, 1.0 MM PITCH, 1152 SOLDER COLUMNS, CERAMIC COLUMN GRID ARRAY, DAISY CHAIN PACKAGE
|
Actel Corporation
|
